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  • MELF package chip thermistor

MELF package chip thermistor

Product features: Cylindrical metal electrodes with leadless interfaces

Application: Widely used in the power semiconductor market, such as IGBTs, power MOSFETs, BJTs, etc.

Product advantages: Utilizes glass encapsulation, offering excellent weather resistance and reliability

Product selection

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MELF series

Model

Size(mm)

Operating temperature range

Thermal time constant

Thermal dissipation coefficient

Rated power

R value

B value

L

D1

D

NM1AH502F34100

3.2±0.1

1.5MAX

1.5MAX

-50℃~+300℃

≤15s

0.877mW/℃

153.47mW

R25=5kΩ±3%

B25150=3375K±1%

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